iPhone 7: does new technology hold key to agent device?

Apple's need for agent and lighter devices will step up a notch with the setup of the iPhone 7, if Korean news web site ETNews is to be believed.

Using a new form of technology would known. they as well as fan-out packaging,in the social media says Apple will arrange to shave off precious millimetres from the device's chassis.

ETNews says the event can even improve battery life and signal strength. Specifically, the technology are going to be applied to the device's antenna switching module and radio frequency (RF) chip.

Fan get out packaging technology essentially makes certain chips a lot of powerful and efficient while additionally are making them too smaller  school corporate executive said. the speculation goes that this will permit Apple to reorganise the components in the iPhone seven a lot of with efficiency. the web site additionally claims ETNews has been a reliable source in the past for Apple information.

Using fan could find out packaging should increase the density of Input/Output terminals among a package, allowing smaller chip sizes, says ETNews. Apple's competitors will presently start using the technology as well, it's adding operate in one

A further boost to Apple comes from the web site Bustle, which reports that the new technology could curtail on interference from outside wireless communication, a flaw that has bugged some Apple users since the iPhone's origination.

Shrinking the chassis of the iPhone 7 is not believed to be a high priority for Apple, per Apple insider. the web site speculates that on prime of the fan-out packaging, the company can also be planning to increase its use of single-chip EMI (electromagnetic interference) shielding, allowing elements to sit down additional closely along.

It is unclear whether the fan could find it out packaging would be introduced instead of the rumoured decision to remove the earphone jack on the iPhone 7, news t